Videos
Vertical Screw Type Injection Molding Machine VE350-D50 / EdeX Machine Operation VE350
The Edex VE350-D50 vertical injection molding machine is designed for precision insert molding applications. Equipped with a high-speed injection unit, digital back pressure control, and energy-saving servo system, it’s compact and efficient—ideal for electronics, connectors, and automotive components. Watch the video to see its performance in action!
Packaging Injection Machine (Fixed table) low pressure molding
The Edex low pressure vertical injection molding machine is designed for delicate components such as wires, sensors, and electronic parts. This demo shows the overmolding process using a fixed mold and low-pressure injection to ensure minimal stress on the part while maintaining high production precision and stability. Ideal for connectors, medical electronics, and automated circuits.
Edex Two-Platen Vertical Injection Machine | Minimalism Meets Molding Mastery
Edex Technology, a professional total solution provider, proudly presents its two-platen clamping vertical injection molding series—where minimalism meets functionality. With a simplified structure and optimized layout, the machine ensures high rigidity, smooth operation, and is adaptable for a wide range of high-precision applications across industries.
EdeX Machine Operation
This video features live demonstrations of 7 key EdeX machine series: Atom300, AtoZ1000, AtoZ1400, ATOP1800, ATOR1200, VTOP400, and EP15. Covering micro injection, dual-material rotary molding, high-volume horizontal systems, and epoxy packaging solutions, each machine is designed for accuracy, energy saving, space efficiency, and high performance. Ideal for electronics, automotive, connectors, medical, and encapsulation industries.
USB packaging low pressure molding
This video demonstrates the EP Series Hot‑Melt Adhesive Low‑Pressure Injection Molding system by EdeX. Featuring precise plunger-type injection, low clamping force, and controlled low-temperature melt, this process safely encapsulates electronic components without damage. Witness fast cycle performance and space-saving packaging.
Technical Highlights
Precise Plunger Injection
Ensures stable, low-pressure molding for delicate electronics.Low Pressure & Clamping Force
1–50 bar injection, 1–15 kN clamping – ideal for sensitive components.Low-Temperature Operation
Molds at 150–220 °C to reduce thermal stress.Fast Cycle Time
10–60 sec per cycle for high efficiency.Zero Waste Process
Direct overmolding, no trimming needed.Compact & Energy-Saving Design
Space-efficient with servo power saving.
Automatic sideview injection production
The video showcases the vertical plunger injection molding process, highlighting stable operation, high precision, and energy efficiency—ideal for micro parts, medical connectors, and tight-tolerance applications.
Technical Highlights
Side‑view injection structure: The nozzle enters the mold from the side, providing better visual access and supporting integration with automated inspection systems.
Vertical plunger injection system: Equipped with precise back pressure and injection speed control to enhance molding accuracy and repeatability.
Designed for micro/medical parts: Specifically engineered for high-precision components such as connectors, plugs, and micro plastic parts.
Energy-efficient and compact design: The vertical structure saves space, while intelligent control systems reduce energy consumption and improve operational efficiency.
Dual-color/resin micro injection electric parts production
This video showcases EdeX high-precision dual-color micro-injection machine, designed for micro-connectors, sensor housings, miniature enclosures, and composite components. It features ultra-fine shot control, stable clamping, and is compatible with automated production and energy-saving goals.
Automatic in-mold injection molding with CCD quality check
This turnkey solution automates the entire injection molding cycle, embedding CCD vision inspection inside the mold cell. Finished parts are inspected in‑line within milliseconds before ejection.
Key Technical Features
High‑resolution CCD camera mounted at eject station for visual inspection of flash, warpage, surface defects.
Fully synchronized PLC control chain to coordinate mold open, eject, image capture, and sorting.
Real‑time image processing algorithm classifies good vs. defective parts instantly.
Supports multi‑cavity molds and high cycle rates with minimal latency.
Seamless data logging for SPC traceability.