Micro-Injection Molding for CPO & Silicon Photonics Connectors

The rise of AI data centers, 800G/1.6T network architectures, and Silicon Photonics has pushed optical communication to a critical turning point. Inside these high-speed networks, data routing relies heavily on Co-Packaged Optics (CPO) and high-density MPO/MTP multi-fiber connectors.

For manufacturers, this means molding components with complex internal geometries, sub-micron tolerances, and incredibly light part weights. Standard injection molding setups often struggle with material degradation in the barrel, flash, or minor variations that ruin optical alignment.

EdeX Technology provides advanced micro-injection molding solutions designed to resolve manufacturing bottlenecks in high-density optical connectivity.

The Precision Bottleneck in Optical Connectivity

Molding components for high-density connectors involves strict parameters:

EdeX Micro-Molding Architecture

EdeX uses a plunger-based system instead of traditional reciprocating screws:

• ATOM Series: Built for parts down to 0.0001g, decoupling plasticization from injection for volumetric displacement.
• Desktop A50 Series: Compact design reducing material waste by 70% to 80%, suited for R&D and prototyping.

Production Parameters & Global Compliance

EdeX systems achieve geometric control \(\le 0.5\ \mu\text{m}\) and shot consistency of \(\pm0.001\text{g}\) with yields >99.8%. Systems are CE certified and recognized for precision design.

Frequently Asked Questions

• Why precision of 0.001g? Any variation over 1 μm misaligns fiber cores and causes signal losses.
• How to prevent degradation? Micro-barrels (12–14mm) and strict temperature control keep residence time under 2 minutes.
• Cost savings? Drastically reduced runner waste and short 6–12 second cycle times lower operating costs.