2019 Innovation and R&D Award (Epimx hot melt adhesive encapsulation injection machine)

The "EpimX Hot Melt Glue Packaging Injection Machine" produced by Idese won the 108th Innovation and Research Award from the New Taipei City Industrial Association. This product is the world's first hot melt glue packaging injection machine that adopts direct plunger injection. Pressure and speed data can be directly input through a touch-screen computer, which can greatly increase production line output.